The perfect form of safety, technology and design!

Automated wafer cutting machines that cut cooled and cream-coated wafer sheets into the final product dimensions desired through stainless-steel blades are designed to provide high safety and minimum maintenance cost.

Automated wafer cutting machines are designed in accordance with Industry 4.0 so that you can control certain data at a single point, such as capacity, energy, efficiency, maintenance, etc.

• Full servo control and open design
• Replaceable cutting cages depending on different product dimensions
• Tailor-made design depending on demands
• Sensitive and high-capacity cutting processes
• Very high band speed optimization depending on the product
• 3 machine inlet axes controlled by servo motor
• Use of servo motor to control number of block layers and cutting speed
• Maximum capacity speed of 20 blocks / minute
• Cutting discards accumulated at a single point through discard conveyor
• Materials suitable for food contact

OPTIONS

Block Buffer Unit: Stacks and feeds products back to the machine in a fully automated manner within a time between 2-5 minutes in case of line suspensions and failures.